@inproceedings{3f27b2b06c47455b97eba097894d18f7,
title = "The study of large area and low pressure die bonding",
abstract = "The critical concerns of heat radiation for Light Emitting Diode (LED) includes the LED material and the following packaging material and process. From the view point of LED structure, the heat resistance of the die attachment layer is the dominant factor of the heat radiation for LED. A well bonding die attachment layer benefits the heat radiation of LED. The ITRI-Bond was utilized in this paper, and has a well effect in die bonding of the large LED and Cu plate. Therefore, this paper develop an instrument for die attachment under local vacuum condition. The required properties of this instrument include vacuuming the chamber within 5sec and the bonding void of LED less than 3\%.",
keywords = "LED bonding, Thermal resistance, Vacuum",
author = "Cheng, \{Hong Ping\} and Cheng, \{Chin Chi\} and Cheng, \{Ren Hau\} and Chen, \{Liang Yu\} and Chang, \{Hsin Hao\} and Lin, \{Guan Ting\}",
year = "2015",
doi = "10.6567/IFToMM.14TH.WC.OS12.003",
language = "???core.languages.en\_GB???",
series = "2015 IFToMM World Congress Proceedings, IFToMM 2015",
publisher = "National Taiwan University",
booktitle = "2015 IFToMM World Congress Proceedings, IFToMM 2015",
note = "14th International Federation for the Promotion of Mechanism and Machine Science World Congress, IFToMM 2015 ; Conference date: 25-10-2015 Through 30-10-2015",
}