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Path Planning for Continuous-curvature Avoidance using Hierarchical Four Parameter Logistic Curves

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3 引文 斯高帕斯(Scopus)

摘要

Robots are widely used as unmanned vehicles in smart factories. In order to operate the robot in a known environment, the robot must be able to plan the path. The planned path must enable the robot to reach a destination from the starting point and the robot must avoid all obstacles during movement.This study uses a four-parameter logic curve path planning method that uses a closed formula solution and a curve with minimal design parameters to quickly generate an ideal path. The characteristics of the curve are used to derive the S and half-S curves as the solution path. The shortest path is used as the selection reference target to select parameters B and C for the four-parameter logic curve. For the S path, the best solution is chosen. The half -S curve is limited by the elastic end-point heading angle, which gives a unique set of parameter solutions. The generated path does not allow the robot to completely avoid obstacles so a hierarchical half-S curve path planning mechanism is used. A via point is generated at the collision point using the gradient vector for the edge of the obstacle. The planner continues to perform half-S path planning until the path planning ends.

原文English
主出版物標題2020 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面3358-3363
頁數6
ISBN(電子)9781728185262
DOIs
出版狀態Published - 11 10月 2020
事件2020 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2020 - Toronto, Canada
持續時間: 11 10月 202014 10月 2020

出版系列

名字Conference Proceedings - IEEE International Conference on Systems, Man and Cybernetics
2020-October
ISSN(列印)1062-922X

Conference

Conference2020 IEEE International Conference on Systems, Man, and Cybernetics, SMC 2020
國家/地區Canada
城市Toronto
期間11/10/2014/10/20

文獻附註

Publisher Copyright:
© 2020 IEEE.

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