TY - GEN
T1 - High density vertical probe card fabrication with low cost and high precision characteristics by using MEMS process
AU - Huang, Jung Tang
AU - Lin, Chung Yi
AU - Lai, Wen Shiung
AU - Chao, Pen Shan
AU - Shih, Sheng Hsiung
PY - 2005
Y1 - 2005
N2 - The goal of this paper is mainly to develop an advanced MEMS probe card, which combines not only micro-electroplating but CMP (Chemical Mechanical Polishing) processes to manufacture a kind of spring-like probe. It is characterized by providing great deformation in its vertical axis (Y-axis). Apart from those specific technologies, finite element simulation software, COSMOS, is also employed to analyze the loading force distributed on the probe tip. Compared to the traditional drawing process, this MEMS-based process is expected to have more flexibile in probe design. Also, this process using batch mode fabrication method is also conducive to reduce the entire fabrication cost. We can reach the outstanding targets as following, hardness higher than HV 550, Young's modulus higher than 180 GPa, fatigue strength higher than 1 million times, maximum loading force about 4 g, and electric resistance less than 10 μΩ-cm.
AB - The goal of this paper is mainly to develop an advanced MEMS probe card, which combines not only micro-electroplating but CMP (Chemical Mechanical Polishing) processes to manufacture a kind of spring-like probe. It is characterized by providing great deformation in its vertical axis (Y-axis). Apart from those specific technologies, finite element simulation software, COSMOS, is also employed to analyze the loading force distributed on the probe tip. Compared to the traditional drawing process, this MEMS-based process is expected to have more flexibile in probe design. Also, this process using batch mode fabrication method is also conducive to reduce the entire fabrication cost. We can reach the outstanding targets as following, hardness higher than HV 550, Young's modulus higher than 180 GPa, fatigue strength higher than 1 million times, maximum loading force about 4 g, and electric resistance less than 10 μΩ-cm.
UR - https://www.scopus.com/pages/publications/33847294325
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AN - SCOPUS:33847294325
SN - 0780395786
SN - 9780780395787
T3 - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
SP - 107
EP - 112
BT - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
T2 - 7th Electronics Packaging Technology Conference, EPTC 2005
Y2 - 7 December 2005 through 9 December 2005
ER -