摘要
In this study, a novel van der Waals (vdW) heterostructure field-effect transistor (FET) using vdW stacking as next-generation device architecture is demonstrated. The MoS2/WS2 heterostructure FET exhibits a large improvement in the drain current and field-effect mobility (from 43.3 to 62.4 cm2 V−1 s−1) compared with single MoS2 FET. Such significant enhancement is mainly due to the charge-transfer effect. The vdW self-encapsulation effect in the device channel also helps to reduce the Schottky barrier height from 120 to 52 meV at the contact interface. Finally, the WS2/MoS2/WS2 double heterostructure FETs further boosts the mobility up to 102.5 cm2 V−1 s−1 at room temperature (25 °C) and 169.7 cm2 V−1 s−1 at 30 K. The much higher mobility exhibited at the lower temperature indicates the suppression of Coulomb scattering. Thus the electrical performance of the double-heterostructure FETs can be further enhanced.
| 原文 | English |
|---|---|
| 文章編號 | 2001850 |
| 期刊 | Advanced Materials Interfaces |
| 卷 | 8 |
| 發行號 | 6 |
| DOIs | |
| 出版狀態 | Published - 23 3月 2021 |
文獻附註
Publisher Copyright:© 2021 Wiley-VCH GmbH
指紋
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