摘要
This study was aimed at better understanding of the effects of ergonomics-based wafer-handling training in a semiconductor fab. The 400 female wafer handlers were given 2 h of the ergonomics-based wafer-handling training course. The identified risk factor ratio (IRFR) in the workplace and workers' musculoskeletal disorders (MSDs) were collected before and after the training. The qualitative efficacy of the training was also obtained through a questionnaire. The responses to the questionnaire reflect the generally positive attitude of the workers towards the training. The results of the IRFR from pre- to immediately post-training proved that the implementation of the training significantly increased safe behavior in work practices. One year after training, no significant decreases in the prevalence of MSDs were found for any body parts except the legs. This ergonomics-based training intervention is considered as a success to reduce risk factors associated with improper work methods and postures, but little data could validate its effectiveness on prevention of all the MSD problems. Relevance to industry: This study demonstrates a systematic approach for examining effects of ergonomics-based wafer-handling training tailored for female fab workers on reductions in work-related risk factors and their musculoskeletal disorders. Although the training course and effect evaluation methods are developed for the semiconductor industry, other similar industries can refer to this paper to design their own ergonomic training courses and evaluate the effects of the training interventions in practice.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 127-132 |
| 頁數 | 6 |
| 期刊 | International Journal of Industrial Ergonomics |
| 卷 | 39 |
| 發行號 | 1 |
| DOIs | |
| 出版狀態 | Published - 1月 2009 |
文獻附註
Funding Information:We would like to express our gratitude to the employees and managers of the study company for their invaluable support for this study. We also acknowledge the National Science Council of the Republic of China (Contract No. NSC93-2213-E-324-023) for partly funding this study.
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指紋
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