Design analysis of a belt furnace for microelectronic ceramic package processing

A study was conducted on the effects of belt speed and flow rate of purging gasses on energy dissipation and transport and the temperature distribution inside a belt furnace used for ceramic package processing. Thus, knowledge of the thermal system leads to optimal thermal management for the firing process, which can assure the quality and reliability of the microelectronic package substrates. This paper analyzes the effects of radiative and convective heat transfers on the substrates and to evaluate their thermal response in a dynamic conveying belt furnace during the heating process.