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A remotely controlled locomotive IC driven by electrolytic bubbles and wireless powering

  • Po Hung Kuo
  • , Jian Yu Hsieh
  • , Yi Chun Huang
  • , Yu Jie Huang
  • , Rong Da Tsai
  • , Tao Wang
  • , Hung Wei Chiu
  • , Shey Shi Lu

研究成果: 書籍/報告/會議論文中的章節會議投稿同行評審

5 引文 斯高帕斯(Scopus)

摘要

As implantable medical CMOS devices become a reality [1], motion control of such implantable devices has become the next challenge in the advanced integrated micro-system domain. With integrated sensors and a controllable propulsion mechanism, a micro-system will be able to perform tumor scan, drug delivery, neuron stimulation, bio-test, etc, in a revolutionary way and with minimum injury. Such devices are especially suitable for human hollow organs, such as urinary bladder and stomach. Motivated by the art reported in ISSCC 2012 [2], we demonstrate a remotely-controlled locomotive CMOS IC which is realized in TSMC 0.35μm technology. As illustrated in Fig. 18.7.1, a bare CMOS chip flipped on a liquid surface can be moved to the desired position without any wire connections. Instead of Lorentz forces [2], this chip utilizes the gas pressure resulting from electrolytic bubbles as the propulsive force. By appointing voltages to the on-chip electrolysis electrodes, one can decide the electrolysis location and thereby control the bubbles emissions as well as the direction of motion. With power management circuits, wireless receiver and micro-control unit (MCU), the received signal can be exploited as the movement control as well as wireless power. Experiments show a moving speed of 0.3mm/s of this chip. The total size is 21.2mm2 and the power consumption of the integrated circuits and the electrolysis electrodes are 125.4μW and 82μW, respectively.

原文English
主出版物標題2014 IEEE International Solid-State Circuits Conference, ISSCC 2014 - Digest of Technical Papers
發行者Institute of Electrical and Electronics Engineers Inc.
頁面322-323
頁數2
ISBN(列印)9781479909186
DOIs
出版狀態Published - 2014
事件2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014 - San Francisco, CA, United States
持續時間: 9 2月 201413 2月 2014

出版系列

名字Digest of Technical Papers - IEEE International Solid-State Circuits Conference
57
ISSN(列印)0193-6530

Conference

Conference2014 61st IEEE International Solid-State Circuits Conference, ISSCC 2014
國家/地區United States
城市San Francisco, CA
期間9/02/1413/02/14

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