研究成果: 專利
}
TY - PAT
T1 - 電子統合多層回路材(Fabric having multiple layered circuit thereon integrating with electronic devices)
AU - 芮, 祥鵬
PY - 2018/8/21
Y1 - 2018/8/21
M3 - 專利
M1 - JP3218683U
ER -