@inproceedings{9b8be3f85e4147d8b3c21cca1bb914fe,
title = "Purging of foup for 450 mm wafer manufacturing",
abstract = "This study is designated to experimentally determine the effect of clean dry air (CDA) purging rate on purging efficiency in a beta version 450 mm PC FOUP, which fully loaded with 25 pieces of dummy wafers. The purging CDA with flow rate range of 30180 L/min (LPM) were tested. The purging gas enters the FOUP through the two rear ports. For each case, a total purging time of 30 minutes was set to simulate the purging process once the mass flow controller was modulated to lead-in the purging gas. Cleanliness requirement of moisture content (RH ≤5\%) within the FOUP was served as key evaluation factor. The results showed that higher purging rate of CDA demonstrate favorable moisture depletion rate within the gaps formed between the wafers. The middle area (wafer slot \#13) was the place that the purge air difficult to reach to and no significant of improvement in purge time was observed for higher purge rates cases i.e. 150 LPM and 180 LPM cases.",
keywords = "FOUP, clean dry air purging, contamination control, polycarbonate, wafer",
author = "Khoo, \{Chun Yong\} and Hu, \{Shih Cheng\} and Huang, \{Che Yu\} and Yang, \{Cheng Wei\} and Bill Chiu and Steven Chou and Jerry Lu and Huang, \{C. T.\}",
year = "2013",
doi = "10.1109/ASMC.2013.6552791",
language = "???core.languages.en\_GB???",
isbn = "9781467350068",
series = "ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings",
pages = "171--173",
booktitle = "2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2013",
note = "2013 24th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2013 ; Conference date: 14-05-2013 Through 16-05-2013",
}