Direct encapsulation of heat-dissipation layer on white organic light-emitting diode by atomic layer deposition

A novel encapsulation technique for direct depositing heat-dissipation layer on white organic light-emitting diode (WOLED) in lighting applications was proposed and demonstrated by atomic layer deposition. Due to the fact that tremendous heat may be generated in WOLED as operated in high brightness mode for lighting applications, the issue of heat dissipation in WOLED must have solutions for practical applications. One of the practical solutions is to deposit a heat-dissipation layer directly on WOLED to create a path for heat flow. A layer of dense alumina approximate I00nm in thickness was direct deposited on a WOLED successfully by using atomic layer deposition technique at room temperature. This direct encapsulated WOLED could operate approximate the same condition as that with traditional class-cap encapsulation.