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電子統合多層回路材(Fabric having multiple layered circuit thereon integrating with electronic devices)

Research output: Patent

Original languageChinese (Traditional)
Patent numberJP3218683U
StatePublished - 21 Aug 2018

Patent Application Number

JP2018003226

Patent Type

發明專利

Country

國外(不含美國)

Date of Patent

21/08/2018

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